Heat sink compound, also known as thermal paste or thermal grease, is a thermally conductive adhesive that improves heat transfer between a heat-generating component (like a CPU or GPU) and a heat sink. It acts as an interface material, filling the air gaps between the surfaces to maximize thermal contact and minimize resistance to heat flow.

Super-flow soldering paste is a specialized type of solder paste designed to enhance the flow and wetting of solder, leading to better solder joints and improved reliability. It's essentially a combination of powdered solder and a flux, where the flux acts as a carrier for the solder particles and aids in removing oxidation, enabling the solder to flow easily and adhere to the surfaces being joined

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