SN50PB50 solder wire

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MOQ : 100 Kilograms

SN50PB50 solder wire Specification

Application
Industrial

Usage
Electronics

Material
Tin/Lead Solder

Size
Standard

Product Type
SN50PB50 solder wire

Melting Point
183-214 Deg C

Weight
200 Grams (g)

Color
Silver

SN50PB50 solder wire Trade Information

Minimum Order Quantity
100 Kilograms

Supply Ability
5000 Kilograms Per Month

Delivery Time
7 Days

Packaging Details
250/500GMS

Main Export Market(s)
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Main Domestic Market
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Certifications
ISO 9001: 2008 Certified Company

About SN50PB50 solder wire

Features:

No Dry Solder.
The Metal used in 100% virgin and correct composition.
Latest alloying techniques to get a homogeneous alloy of the right composition
Proper quality for Metal and flux composition checked by highly skilled technician and engineers.
Wires of size upto 26 SWG and any weight available.
Entirely non-corrosive, non-conductive and fungus resistance.
Fast spreading action and Minimum resistance.

Form And Size:
Solder wire is supplied in Coil form. Each coil weighs 50 gms.100gms.250gms.and 500gms.
Solder wire is manufactured in 14,16,18,20,22,24 and 26SWG. Tolerance on wire diameter is within 0.1 mm. It can also be supplied in other sizes with solid, single core, multicore flux to suit customer s requirement.

Leaded Solder Wire

Sn63 / Pb37 No Clean Leaded Solder
Sn60 / Pb40 No Clean Leaded Solder
Sn63 / Pb37 Leaded Solder
Sn60 / Pb40 Leaded Solder
Urea Flux core solder wire
Stained Glass Solder wire
Solder wires as per customer specifications

Non-Leaded Solder Wire

Sn96 Lead Free Solder (SAC 305) (m.p.217-220 C)
Sn99.7%/Cu 0.3% Lead Free Solder(m.p.227-220 C)
Sn99.3%/Cu 0.7% Lead Free Solder(m.p.227-220 C)
Pure Tin 100%

ALLOY NAME	SOLIDOUS	LIQUIDOU
Sn 96.5 / Ag 3.5	221 C	E
Sn96.5/Ag	217 C	219 C
Sn 99 / Ag 0.3 / Cu 0.7	227 C	E
Sn 95 / Sb - 5	235 C	240 C
Sn 99	232 C
Sn 99.3 / Cu 0.7	227 C	E
Sn 97 / Cu 3	227 C	300 C
Sn 96 / Ag 4	221 C	223 C